Washington pours $3B into silicon smackdown to outpackage Asia Dátum: 2023-11-21 [theregister.co.uk]
Uncle Sam rolls up sleeves to onshore work and protect supply chain
The US has earmarked $3 billion in funding it hopes will drive US leadership in advanced packaging technologies, seen as a key part of the future semiconductor industry. A TELJES HÍR ELOLVASÁSA >>
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